StenTech® Inc., a leading global company specializing in SMT Printing Solutions, is proud to announce the U.S. launch of its StenTech BluPrint™ PVD Stencils, a groundbreaking Physical Vapor Deposition (PVD) technology that optimizes SMT production by enhancing precision, durability, and productivity. With 98% transfer efficiency, StenTech BluPrint™ maintains consistent performance across high-volume runs of up to 50,000 prints, reducing cleaning cycles by up to 300%. This advanced coating supports complex PCB designs with lower area ratios, resulting in fewer disruptions, minimized defects, and higher throughput.
“We are proud to introduce StenTech BluPrint™ to the U.S. market, offering manufacturers a solution that elevates reliability and cost-efficiency,” said Brent Nolan, President & COO of StenTech. “Our unique vapor deposition coating helps push design boundaries while ensuring lasting stencil performance, making it ideal for today’s high-demand SMT environments.”
StenTech BluPrint™ combines anti-stiction properties, high thermal stability, and customizable coating characteristics, ensuring precision solder paste deposition and a smooth, reliable finish for every application. With StenTech BluPrint™, manufacturers can achieve greater productivity, fewer disruptions, and more confidence in every print. This technology elevates SMT processes to a new level of efficiency and reliability.
For more information about StenTech and the StenTech BluPrint™ PVD Surface Treatment, please visit www.stentech.com/BluPrint.
