KOKI, a global leader in advanced soldering materials and process optimization services, will showcase its new E14 Series lead-free solder paste at IPC APEX 2025, from March 19-21, 2025, in Anaheim, CA. Visitors can find KOKI at Booth 2410, where the company will unveil the newly developed flux technology compatible with formic acid reduction reflow ovens. This technology offers solutions to the issues associated with conventional power device soldering.
Interested in learning more about the new technology? On March 19th, from 9:30 to 11:30 a.m. PDT, in Room S20, Shantanu Joshi, Head of Customer Solutions and Operational Excellence, will present “Flux Technology Development for Solder Paste Compatible with Formic Acid Reflow Ovens for Power Devices.”
Key product highlights include:
- ZERO flux residue after reflow eliminates the need for post-soldering cleaning and ensures smooth transitions to subsequent processes.
- Engineered to maximize the reduction efficiency of formic acid while leveraging the benefits of formic acid reduction reflow ovens, which are widely adopted in power device manufacturing for reliable soldering of devices such as MOSFETs, IGBTs.
- Available for both printing and dispensing, offering stable performance for high volume manufacturing applications
This innovative flux technology is designed to meet the growing demand for better performance and efficiency in power device soldering, offering a practical solution for next-generation manufacturing processes.
Attendees at IPC APEX 2025 are encouraged to meet with KOKI’s team of experts to learn more about this cutting-edge technology and how KOKI’s soldering solutions can optimize their production processes. To arrange a meeting, visit KOKI IPC APEX Meeting Request.
