The SMTA Juarez Expo & Tech Forum, held at the Injectronics Convention Center in Ciudad Juarez, brings together electronics manufacturing professionals from across the region for one day of networking and technical exchange.
Visit Essemtec at Booth 20.
Join Enrique Gomez and Alonso Poulido to discuss how Essemtec’s flexible All-in-One solutions for dispensing and placement can support your high-mix, low-volume production needs – even when space or speed matters most.
We’ll also be happy to talk about our capabilities in repair, rework, and reballing – along with advanced process solutions for the aerospace and defense industries, where high-mix, low-volume production and Tarantula Underfill technology help meet strict reliability and process control requirements.
Our high-speed jetting of solder paste and glue is ideal for automotive and consumer electronics, where precise, contactless dispensing is essential for complex and compact designs demanding both speed and accuracy.
For more information regarding Essemtec please visit Essemtec.com or contact Enrique Gomez, Business Development Manager, Mexico, enrique.gomez@nano-di.com.
