Infineon Technologies has introduced a compact solid state isolator family for programmable logic controllers, relay modules, industrial automation, laboratory power supplies, automated test equipment, building controls, and telecommunications systems.
The ISSI20BxxF devices are supplied in a PG DSO 8 package with a footprint comparable to established photovoltaic isolator products. Infineon has developed the family for equipment in which board area, protection, switching performance, and long operating life must be balanced.
Electrical isolation allows a control signal to pass between circuit domains without a direct conductive connection. It separates sensitive logic from higher voltages, interrupts unwanted current paths, supports safety, and prevents some faults from propagating directly into the controller.
Industrial designers can choose between electromechanical relays, optocouplers, photovoltaic isolators, and solid state devices, each offering a different balance of size, switching speed, lifetime, power delivery, leakage, contact wear, and fault behaviour.
The ISSI20BxxF family uses Infineon’s coreless transformer technology to transfer both a control signal and energy across the isolation barrier. The transferred energy drives an external power switch, removing the need for a separate isolated gate supply.
Eliminating that supply can reduce transformers, converters, passive components, board area, and design effort. Engineers can still select the external power device according to the voltage, current, resistance, switching, and thermal requirements of the application.
Infineon has integrated overcurrent and overtemperature protection, rapid fault turn off, and latch off functions within the isolator. Selected versions also provide a dynamic Miller clamp and faster turn on behaviour for circuits exposed to more demanding transient conditions.
Protection positioned close to the switching function can respond more quickly than a controller operating elsewhere in the system. It may also reduce the quantity of external circuitry required to detect and manage abnormal current or temperature.
The range includes the ISSI20B02F, ISSI20B03F, and ISSI20B11F, each providing 3kVrms isolation, 4mm creepage, and UL 1577 certification. Equipment developers must still assess the complete insulation system against working voltage, transient conditions, pollution degree, printed circuit board layout, clearance, and the applicable product standard.
Programmable logic controller input and output systems are among the principal applications. These modules connect controllers with valves, contactors, solenoids, motors, lamps, sensors, and other field equipment, exposing compact electronic assemblies to varied loads and electrically noisy conditions.
Solid state switching removes mechanical contacts and can support faster operation, silent switching, and longer life where cycles are frequent. Leakage current, heat generation, and semiconductor failure modes must still be managed through device selection, protection, diagnostics, and thermal design.
The component family also reflects pressure to fit more channels into smaller automation equipment. Remote input and output systems, distributed machine modules, laboratory instruments, and building controls are handling more data and diagnostic functions without equivalent growth in enclosure size.
Higher channel density increases local heat and reduces the physical separation available between functions. Package size therefore has to be considered alongside creepage, airflow, copper area, component spacing, and the temperature limits of neighbouring devices.
Automation equipment is also expected to remain available for long periods with limited maintenance. Integrated protection can support that objective where fault information is exposed clearly to the control and maintenance systems rather than remaining confined within the component.
Infineon’s Dresden power semiconductor fabrication plant has entered operation, producing intelligent power and analogue or mixed signal devices for electric vehicles, renewable energy, industrial equipment, data centres, and electrical grids.
Industrial systems depend heavily on mature and specialist semiconductor processes as well as the advanced digital nodes receiving much of the current investment. Isolation, power switching, analogue measurement, sensing, and motor control devices often remain in production for many years because machine builders require stable designs and replacement availability.
Product longevity will influence adoption of the new isolators, since automation manufacturers are unlikely to redesign a module without confidence in qualification, documentation, supply continuity, and controlled product changes. Components may remain in service long after the original machine has left production.
Smaller isolation devices also support the movement of control electronics closer to machinery. Distributed modules can reduce cable runs and central cabinet size, although greater exposure to heat, vibration, moisture, and electromagnetic disturbance makes protection and packaging more demanding.
The ISSI20BxxF family extends solid state isolation into applications previously served by electromechanical and photovoltaic devices. Its industrial performance will be determined by the reduction in supporting circuitry, the behaviour of its integrated protection, and the availability required for long life control equipment.
