E-tronix, a Stromberg Company, is excited to announce an upcoming webinar in collaboration with
BTU. The “Solder Reflow Oven Fundamentals and Thermal Profiling Approaches” session will take place on Thursday, April 17, at 1:00 PM CDT and will be presented by industry expert Bob Bouchard.
This comprehensive webinar will provide valuable insights into reflow oven technology. It will cover key topics such as heating methods, atmosphere control, hardware configurations, and forced convection, all essential for optimising reflow processes. Additionally, attendees will gain a deeper understanding of thermal profiling, aligning profiles with solder paste manufacturer specifications, and best practices for process monitoring.
Who Should Attend?
This session is designed for SMT engineers, process managers, and production supervisors working in PCB manufacturing. Attendees will learn strategies to optimise oven settings, enhance production consistency, and reduce defects. By mastering these fundamentals, participants will be better equipped to troubleshoot issues, improve yield, and maintain high soldering quality.
Don’t miss this opportunity to deepen your knowledge of reflow soldering technology and improve your manufacturing processes.
Register Today: https://meet.zoho.com/iQUY-GFm-IpT
