BTU International to Present Webinar on Solder Reflow Oven Fundamentals and Thermal Profiling
BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, is pleased to announce an exclusive webinar, Solder Reflow Oven Fundamentals and Thermal Profiling Approaches, hosted by E-Tronix, BTU’s representative. This in-depth session, presented by Bob Bouchard, will equip SMT engineers, process managers, and production supervisors with the knowledge and tools to optimize their reflow processes for maximum yield and reliability.
Scheduled to take place Thursday, April 17th, from 1-2 p.m. CST, this webinar will cover key aspects of reflow oven technology, including:
- Heating methods and atmosphere control
- Hardware configurations and thermal profiling
- Aligning profiles with solder paste specifications
- Process monitoring and troubleshooting strategies
Participants will gain valuable insights into fine-tuning thermal profiles, leveraging process monitoring tools, and addressing common challenges in PCB manufacturing. By attending, industry professionals will walk away with practical techniques to enhance soldering quality, improve process consistency, and reduce defects.
Don’t miss this opportunity to elevate your reflow soldering expertise!
Register now: https://meet.zoho.com/qAeP-C9f-NmC
For more information about BTU International and its industry-leading reflow solutions, visit www.btu.com.
