Federal Electronics, a leader in providing advanced electronic manufacturing services, will have a strong presence at the 2025 IPC APEX EXPO, with Will Oliver, Vice President of Business Development, and Ed Evangelista, President, participating in two key panel discussions on defence electronics and high-reliability manufacturing.
On Wednesday, March 19, at 9:00 a.m. Will Oliver will be part of the “Defense Electronics and Next-Gen Technologies” panel, hosted by Global SMT & Packaging at Booth #1046. As defense systems become more advanced, the role of cutting-edge electronics in enhancing security, resilience, and operational effectiveness has never been more critical. Oliver will join industry experts to explore AI-driven systems, cyber-secure hardware, next-gen sensors, and communication technologies while addressing the challenges of development, integration, and deployment.
Later that morning, at 11:20 a.m., Ed Evangelista will share his insights during the “High-Reliability Manufacturing in EMS: Delivering Quality and Innovation for Aerospace, Defense, and Medical Markets” panel, hosted by What’s New in Electronics (WNIE) at Booth #1602. With increasing demands for precision, compliance, and innovation, manufacturers in these industries must continuously evolve to meet strict quality and regulatory requirements. Evangelista will highlight Federal Electronics’ approach to advanced manufacturing, rigorous testing, supply chain resilience, and the integration of emerging technologies such as automation, AI-driven inspection, and additive manufacturing.
“Federal Electronics has built its reputation on delivering mission-critical solutions for industries where failure is not an option,” said Evangelista. “We are excited to bring our expertise to these important discussions and help drive the future of high-reliability manufacturing.”
For more information about Federal Electronics and its manufacturing capabilities, visit www.federalelec.com or contact sales@federalelec.com.
