KOKI, a global leader in advanced soldering materials and process optimization services, is pleased to announce an upcoming webinar: Enhancing Solder Joint Reliability Through Advanced Materials Development. The event will take place on Thursday, September 11, 2025, at 12:00 PM CDT.
Hosted by Shantanu Joshi, Head of Customer Solutions and Operational Excellence, this session will address the growing challenges of solder joint reliability in high-reliability and automotive applications. As electronic devices continue to shrink, traditional SnAgCu alloys may not withstand the demands of extreme environments.
The webinar will explore advanced lead-free alloys, including tin-silver-bismuth-indium compositions, as well as results from soldering evaluations and accelerated thermal cycling tests. In addition, Shantanu will highlight KOKI’s development of a “crack-free” flux paste, engineered to resist residue cracking and maintain insulation resistance under harsh conditions.
This event provides attendees with practical insights into enhancing solder joint performance and improving reliability in their most demanding applications.
