HyRel Technologies, a global provider of quick turn semiconductor modification solutions, is pleased to announce its participation in the SMTA Ultra High Density Interconnect (UHDI) Symposium, organized by the Surface Mount Technology Association (SMTA). The conference is scheduled to take place Tuesday, March 26, 2024 in Peoria, AZ.
Brian Watson, Founder of HyRel, will moderate the Workforce Development Breakfast. This engaging session will feature industry leaders from HyRel, TSMC, AMKOR, and Latham Industries, providing valuable insights into the evolving landscape of workforce development in the manufacturing sector.
Workforce Development Breakfast Panel:
- Moderator: Brian Watson, Founder, HyRel
- Panelists: Representatives from TSMC, AMKOR, Latham Industries and HyRel
Scott Baker, Co-founder of HyRel, will be representing the company during the panel discussion. With a focus on advancing manufacturing technologies, HyRel continues to contribute to the dialogue on high-density interconnect solutions. The SMTA UHDI Symposium brings together industry leaders to discuss critical topics in workforce development and advanced manufacturing.
For more information about HyRel and its groundbreaking Robotic Hot Solder Component Tinning process, please visit www.HyRel.tech.
