Federal Electronics Continues to Enhance Inspection Capabilities at Hermosillo Facility: Installs New Mycronic PI Primo M 3D SPI System

Federal Electronics Continues to Enhance Inspection Capabilities at Hermosillo Facility: Installs New Mycronic PI Primo M 3D SPI System

Federal Electronics, a leader in providing advanced electronic manufacturing services, has installed a new Mycronic PI Primo M 3D Solder Paste Inspection (SPI) system at its Hermosillo, Mexico facility, advancing the site’s precision inspection and process control capabilities. The PI Primo M, part of Mycronic’s advanced SPI platform, delivers high-speed, high-resolution 3D inspection for solder…


Federal Electronics, a leader in providing advanced electronic manufacturing services, has installed a new Mycronic PI Primo M 3D Solder Paste Inspection (SPI) system at its Hermosillo, Mexico facility, advancing the site’s precision inspection and process control capabilities.

The PI Primo M, part of Mycronic’s advanced SPI platform, delivers high-speed, high-resolution 3D inspection for solder paste applications, enabling immediate feedback and tighter control of the printing process. With its compact design and fast throughput, the system is well suited for Hermosillo’s high-mix, fast-paced production environment.

“Our Hermosillo operation is built for performance and precision,” said Ed Evangelista, President of Federal Electronics. “Adding the PI Primo M allows us to further improve consistency and accuracy across every board, particularly for the AS9100 programs we’re supporting.”

Federal Electronics’ Hermosillo facility plays a central role in the company’s global operations, offering cost-effective, nearshore manufacturing to OEMs throughout North America. The site is fully integrated with the company’s Cranston, Rhode Island headquarters via a shared ERP and IT infrastructure, enabling real-time coordination, traceability, and seamless production management across both locations.

Staffed by over 350 skilled professionals, the Hermosillo facility is fully equipped for high-reliability, high-mix electronics assembly. It now supports a growing number of AS9100-certified programs and serves OEM customers across the Midwest, Southwest, and Western United States seeking agile, U.S.-aligned manufacturing solutions.

The addition of the PI Primo M strengthens Federal Electronics’ ongoing effort to scale its capabilities with leading-edge inspection and automation technology—helping OEMs accelerate delivery timelines, reduce errors, and achieve their production goals with greater efficiency.

For more information on Federal Electronics and its manufacturing capabilities, visit

 www.federalelec.com or contact sales@federalelec.com.


Stories for you


  • 3D Systems extends Air Force metal AM programme

    3D Systems extends Air Force metal AM programme

    3D Systems wins further Air Force funding for metal printing. The additional $9m takes programme funding to $27.4m and extends large-format, high-temperature additive manufacturing development for another two years.


  • Baker Hughes wins Kutei subsea systems contract

    Baker Hughes wins Kutei subsea systems contract

    Baker Hughes will supply 17 subsea trees for Kutei development. The Indonesia-manufactured package also includes manifolds, controls, distribution systems, and condition monitoring for the Geng North and Gehem fields.