Edgewater Wireless Systems has achieved a significant milestone in silicon production and is now transitioning its packaging operations to a facility in North America.
“Over the last few months, our team has successfully completed numerous critical steps in our silicon production and commercialisation efforts. We’ve strengthened our IP portfolio with several new patent applications. We’ve identified a new vertical market for our Wi-Fi Spectrum Slicing solutions,” said Andrew Skafel, President and CEO of Edgewater Wireless Systems. “And, working with our strategic partners, we’ve achieved a major milestone and have created a capital-efficient path for packaging our Wi-Fi Spectrum Slicing solutions in North America.”
By harnessing the broader Canadian silicon ecosystem, the company has secured a reliable, domestic supply chain for its advanced Wi-Fi Spectrum Slicing silicon solutions. The initial packaging efforts in Canada will focus on the company’s cutting-edge Wi-Fi RF Front Ends, designed for global residential, enterprise, and Industrial IoT applications. The packaging initiative, set to begin in September 2024, marks a crucial step towards bringing engineering samples to market and positions the company to deliver within the year.
This production milestone aligns with the successful commercial pilot and the recently announced Letter of Intent (LOI) with WCS Europe in the Industrial IoT market. WCS Europe is targeting the European enterprise access point market, establishing a new market vertical for Wi-Fi Spectrum Slicing. Their commercial pilot highlights the broader market potential of Edgewater’s Wi-Fi Spectrum Slicing technology, with shipments expected to begin in late 2024.
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