News


  • IMI improves PET bottling air efficiency

    IMI has improved PET bottling output with redesigned pneumatics architecture. The customised Tech-Long solution increases production capacity while cutting compressed air consumption.


  • NEURA expands physical AI robotics portfolio

    NEURA Robotics is expanding physical AI through its automation platform. The company is showcasing cognitive robots, humanoids, cobots, mobile transport systems, and real-world training environments.


  • Verista targets pharmaceutical tray inspection accuracy

    Verista is targeting tray reconciliation with AI-enabled pharmaceutical inspection systems. COUNTQ combines deep learning, cameras, lighting, and electronic verification to improve production counting accuracy.


  • HMS launches rugged industrial Ethernet switches

    HMS Networks has launched rugged switches for industrial Ethernet networks. The NT7000 platform targets high-availability automation environments with Gigabit connectivity, redundancy, and precision timing.


  • Airbus advances Ravenstorm combat drone programme

    Airbus is advancing Ravenstorm within Europe’s collaborative combat aircraft plans. The U760 concept adds a larger uncrewed aircraft to the continent’s future air systems portfolio.


  • Covestro advances continuous bio-based aniline production

    Covestro is pushing bio-based aniline toward continuous industrial production routes. The EU-backed project will scale fermentation, catalysis, analytics, and downstream processing for polyurethane supply chains.


  • Mercedes-Benz scales axial flux motor production

    Mercedes-Benz has industrialised axial flux motors at Berlin-Marienfelde’s historic plant. The site combines new production processes, laser joining, AI quality control, and precision assembly.


  • Nearfield funding targets semiconductor metrology scale

    Nearfield Instruments has raised fresh capital to scale semiconductor metrology. The Rotterdam company will expand manufacturing and customer support as advanced chipmakers face tighter process control demands.


  • Thales venture strengthens European chip packaging

    Thales, Radiall, and Foxconn are expanding European semiconductor packaging capacity. The Tessalia venture will produce advanced system-in-package components in France for high-reliability electronics markets.


  • ArcelorMittal and AWS expand steel automation

    ArcelorMittal is moving steel automation deeper into AWS infrastructure globally. The collaboration links cloud, AI, edge systems, digital twins, and industrial data to production reliability and lower carbon supply.