Indium Corporation, a leading materials refiner, smelter, manufacturer, and supplier, today announced the global availability of WS-910 Flip-Chip Flux, a new water-soluble flip-chip dipping flux designed to meet the demands of cutting-edge semiconductor devices.
WS-910 Flip-Chip Flux is designed to provide best-in-class residue cleaning for a water-soluble flip-chip flux, allowing for excellent compatibility with molded and capillary underfill. The new product also offers high tackiness for a flip-chip flux, which is useful when holding large die in place during the reflow process. WS-910 expands Indium Corporation’s extensive line of semiconductor assembly solutions, supporting advanced packaging and high-reliability applications.
Halogen-free WS-910 Flip-Chip Flux delivers several benefits to users, including:
- High tackiness minimizes non-wet open defects and “cold joints”
- Promotes excellent solderability onto a wide range of surfaces
- Ensures consistent yields through consistent dipping performance over extended periods
- Excellent cleaning with pure room-temperature deionized water
- Designed for Pb-free applications and suitable for all high-Sn solders
- Compatible with a wide variety of conventional ultrafiltration and modified ultrafiltration
Indium Corporation’s flip-chip flux series addresses common miniaturization challenges, including thin or warped substrates and fine-pitch, high I/O count assembly. The company offers fluxes in both water-soluble formulations and ultra-low residue no-clean options, which provide a sustainable, low-residue alternative to traditional water-soluble fluxes.
To learn more about Indium Corporation’s flip-chip flux products, visit https://www.indium.com/products/fluxes/semiconductor-fluxes/flip-chip-flux/.
