Seika Machinery to Sponsor and Present at the High Reliability Technology Advancement Research Forum

Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, is pleased to announce its participation as both a presenter and sponsor at the High Reliability: Strategic Technology Advancement Research Forum. The event is scheduled to take place Thursday, May 2, 2024 at the Embassy Suites by Hilton Kansas City Olathe in Olathe, Kansas.

Charlie Fujikawa, Senior Sales Engineer at Seika Machinery, will deliver a presentation titled “The Importance of Having a Clean Slate in the SMT Assembly Process for High-Density and Fine-Pitch Applications.” In today’s SMT industry, characterized by ongoing miniaturization and global expansion, manufacturing processes encounter unique challenges. Among these challenges, the cleanliness of the PCB surface is a critical factor that is often overlooked. Even the slightest presence of debris or contaminants can disrupt the soldering process, resulting in voids and defects. Fujikawa’s presentation will emphasize the significance of commencing the assembly process with a pristine PCB surface.

The presentation will feature an experiment and evaluation conducted by a renowned Japanese automotive electronics manufacturer. Seeking to enhance their PCB assembly process, they implemented a bare board cleaner before the paste printer. The evaluation will compare conditions before and after the implementation of the cleaning system, providing valuable insights into the impact of a clean PCB surface on defect ratios. Fujikawa’s presentation aims to demonstrate the effectiveness of utilizing a bare PCB surface cleaner as a crucial step in process control.

Seika Machinery is proud to sponsor this event, which serves as a platform for industry experts to exchange knowledge and discuss advancements in high-reliability technology.

For more information about Seika Machinery, visit www.seikausa.com.