SHENMAO Low-Temperature Solder Paste PF735-PQ10-10 Is Designed for High-Speed Printing Processes

SHENMAO Low-Temperature Solder Paste PF735-PQ10-10 Is Designed for High-Speed Printing Processes

SHENMAO Technology is pleased to announce that its PF735-PQ10-10 Low-Temperature Lead-Free Solder Paste is specifically designed for SMT processes, offering a low melting point to accommodate high-speed printing processes. Designed to meet the evolving needs of the electronics manufacturing industry, PF735-PQ10-10 offers a range of features and benefits to enhance SMT processes and improve production…


SHENMAO Technology is pleased to announce that its PF735-PQ10-10 Low-Temperature Lead-Free Solder Paste is specifically designed for SMT processes, offering a low melting point to accommodate high-speed printing processes. Designed to meet the evolving needs of the electronics manufacturing industry, PF735-PQ10-10 offers a range of features and benefits to enhance SMT processes and improve production efficiency.

Key Features of PF735-PQ10-10:
• Halogen-Free Composition: PF735-PQ10-10 is halogen-free (ROL0), with no halogen intentionally added. It complies with RoHS, RoHS 2.0, and REACH regulations, ensuring environmental sustainability and safety.
• Excellent Solderability: The solder paste exhibits excellent solderability, enabling reliable and robust solder joints in electronic assemblies.
• √Great Voiding Performance: PF735-PQ10-10 demonstrates outstanding voiding performance, minimizing defects and enhancing product reliability.
• Prevention of BGA/CSP Hot-Tearing: The solder paste helps prevent BGA/CSP hot-tearing, contributing to improved reliability and durability of electronic components.
• High-Speed Printability: With high-speed printability capabilities, PF735-PQ10-10 enhances production efficiency and throughput.
• Customizable Powder Size: Available in T4 to T6 powder sizes, PF735-PQ10-10 can be tailored to meet specific customer requirements.

With the increasing demand for ultra-thin packages, reducing package thickness can lead to warpage and production yield loss. PF735-PQ10-10 addresses this challenge by reducing the reflow temperature to below 190°C, compared to typical lead-free soldering temperatures of 240°C-250°C. This decrease in temperature helps minimize PCB and substrate deformation, saving energy, reducing thermal stability requirements, and increasing yield rates. PF735-PQ10-10 has already been successfully mass-produced in applications such as laptops.

PF735-PQ10-10 is suitable for a wide range of precise electronic products, including laptops, PCs, servers, and LED modules.

For more information, please visit www.shenmao.com. 


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