ZESTRON, the leading global provider of high-precision cleaning products, services, and training solutions in the electronics manufacturing and semiconductor industries, is pleased to announce an upcoming webinar titled “Unveiling Defluxing Strategies for High-Density Advanced Packaging with Ultra-Fine Pitch Die on CoWs.” The webinar will take place on July 18, 2024, at 2:00 PM EDT.
Join us for an insightful session led by Sr. Applications Engineer Ravi Parthasarathy as he delves into the advancements in heterogeneous integration in semiconductor technology. This webinar will explore the transition from chip-on-substrate (CoS) to chip-on-wafer (CoW) technology, highlighting the integration of chips onto an interposer with wafer-level molding and flip chip (FC) substrate connection.
Ravi will share his extensive research originally presented at the IMAPS Device Packaging Conference, focusing on ultra-fine pitch CoW devices with bump pitches under 25μm and over 150K bump counts. Attendees will gain valuable insights into the efficacy of low-concentration alkaline cleaning agents compared to de-ionized water inline systems. Additionally, the webinar will cover the impact of wash temperatures and conveyor belt speed on cleaning effectiveness, utilizing visual inspection, FTIR analysis, and SEM/EDX testing.
This webinar is a must-attend for professionals seeking to enhance their understanding of heterogeneous integration and advanced cleaning techniques in semiconductor technology. Don’t miss this opportunity to learn from an industry expert and stay ahead of the curve in high-density advanced packaging.
For more information and to register for the webinar, please visit theWebinar Registration Page.
