News
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OPRL has launched an updated tool to help members demonstrate the recyclability of packaging products under new Extended Producer Responsibility for Packaging (pEPR) legislation. OPRL’s online tool will help producers – brands and importers – meet the obligation for reporting data under pEPR, as well as offering support with packaging improvements. Designed to guide packaging…
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SIG, the pioneer of aseptic carton packaging without aluminum layer, announces the commercial launch of another industry-first: SIG Terra Alu-free + Full barrier for multi-serve aseptic cartons. Building on the success of this groundbreaking packaging material innovation in the field of single-serve cartons – with over 300 million packs sold in China since 2023 –…
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Justin Worden from What’s New in Electronics TV talks to Melanie Mathon from Inventec at IPC APEX 2025 in Anaheim, USA. [embedded content] WNIE TV is kindly sponsored by Axxon Mycronic, BTU, Kyzen, Kurtz Ersa, Koh Young Technology, Nordson Test & Inspection, Viscom, EVS, Indium, ROKA Solutions, ART, and Saki.
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Photo by natsuki on Unsplash Load growth and expected higher temperatures could push peak demand higher this summer, potentially straining resources in some regions, according to the North American Electric Reliability Corporation (NERC) 2025 Summer Reliability Assessment. Although the North American Bulk Power System (BPS) is expected to have sufficient resources under normal summer conditions,…
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Cumberland Electronics Strategic Supply Solutions (CE3S), your strategic sourcing, professional solutions and distribution partner, is proud to partner with Desco Industries to offer a free four-part training series on the ANSI/ESD S20.20-2021 standard, the internationally recognized guideline for establishing and maintaining robust ESD (electrostatic discharge) control programs. Beginning Tuesday, August 5, 2025, this live, instructor-led…
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Medco West Enhances PCB Cleaning Capabilities with Installation of Typhoon T9 Aqueous Inline Cleaner
Medco West Electronics, Inc., a leader in high quality electronic assemblies, is pleased to announce the installation of a Typhoon T9 Aqueous Inline Cleaning System from Aqua Klean Systems. This upgrade enhances the company’s printed circuit board (PCB) cleaning process, supporting higher levels of quality, process control, and reliability for its customers across medical, industrial,…
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SureCore, the leading memory specialist, has announced the expansion of its sureFIT design service to include AI applications, using its memory design expertise to help AI chip developers achieve their complex power and performance goals. Paul Wells, CEO at sureCore, explains: “AI can be a daunting new challenge for many chip developers. Because of the…
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KMC amba has announced a new collaboration with Daymer Ingredients Limited, a well-known ingredient distribution business with headquarters in the UK. By providing food makers in the UK with value-adding potato-based solutions, this partnership is expected to improve both businesses’ growth strategies. Adam Shaw, country manager UK and Ireland at KMC, commented: “Finding the right…
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CEA-Leti will host the 27th edition of the LID World Summit in Grenoble from 17–19 June 2025, bringing together more than 1,100 leaders from across the global semiconductor ecosystem. The event will take place at Maison Minatec and is set to highlight cutting-edge developments in artificial intelligence (AI), photonics, sustainable electronics and hardware design for…
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In the current marketplace, Bill of Material (BOM) costs are continuing to rise and developers must work to optimize performance and budgets. Recognizing that a significant portion of the mid-range FPGA market does not require integrated serial transceivers, Microchip Technology is releasing PolarFire® Core Field-Programmable Gate Arrays (FPGAs) and System on Chips (SoCs). The new…
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