Altus Group Introduces Innovative BGA Reballing Solution to Meet Growing Sustainability Demands

Altus Group Introduces Innovative BGA Reballing Solution to Meet Growing Sustainability Demands

Altus Group, a leading distributor of capital equipment in the UK and Ireland, has introduced an advanced BGA re-balling solution to address the electronics industry’s growing focus on sustainability and cost-efficiency. Developed by their pre-eminent supplier, Essemtec, this innovative process offers manufacturers a new approach to component recovery and reuse, aligning with increasing market demands…


Altus Group, a leading distributor of capital equipment in the UK and Ireland, has introduced an advanced BGA re-balling solution to address the electronics industry’s growing focus on sustainability and cost-efficiency. Developed by their pre-eminent supplier, Essemtec, this innovative process offers manufacturers a new approach to component recovery and reuse, aligning with increasing market demands for environmentally conscious practices.

Building on their expertise in adaptive SMT equipment, Essemtec has designed a cutting-edge BGA re-balling process that consolidates flux deposition, ball placement, and soldering into a single streamlined solution. This all-in-one approach is particularly advantageous for high-volume OEMs and companies in sectors such as military, aerospace, computing, and communication, providing a cost-effective and sustainable method for component recovery and reuse.

Jiri Kucera, Operations Director at Altus Group, said: “Reworking BGAs, recovery of expensive parts, and re-use is becoming a highly discussed topic across the electronics industry as consumers become more interested in sustainability. This is another example of Essemtec developing a process to meet the needs of the market.”

The new robotic process offers several advantages over traditional manual methods:

  1. Increased precision and reliability.
  2. Support for various ball sizes (250 µm to 1 mm+) and materials.
  3. Improved success rates compared to manual stencil techniques.
  4. Cost-effective reuse of expensive BGA components.

Jiri added, “Companies are already using the Essemtec jetting unit for BGA re-balling across a range of pitched components, giving partners the power to bring some of the recovery processes back in-house rather than outsource to partners at a higher cost.”

This solution is particularly relevant for organisations prioritising environmental impact and sustainability. By extending the lifecycle of electronic components, the process contributes to waste reduction and promotes a more circular economy in electronics manufacturing.

Altus sees this technology as a significant step in meeting the electronic industry’s evolving needs. As sustainability continues to gain importance, solutions like this will play a crucial role in shaping the future of electronics manufacturing and repair.

 


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