KIC, a renowned pioneer in thermal process and temperature measurement solutions for electronics manufacturing, is excited to announce its participation at the upcoming SMTconnect exhibition, taking place June 11-13, 2024 in Nuremberg, Germany.
Find KIC at the SmartRep booth 4A.225 where the company will showcase its latest innovation, Contact-less Thermal Analysis™. This groundbreaking technology enables real-time monitoring of temperature and convection changes by directly measuring board temperatures during production. With Contact-less Thermal Analysis™, manufacturers can achieve unmatched accuracy in reflow profiles, ensuring optimal quality and reliability in the production process.
Moreover, KIC will introduce its new profiling software platform, the Thermal Analysis System, featuring the addition of a cutting-edge recipe optimization search mode called Common Recipe Finder™. The Thermal Analysis System software offers a state-of-the-art User Interface, providing flexibility in reflow and wave recipe setup with a user experience akin to browsing. Common Recipe Finder™ simplifies changeover time by identifying a single recipe for multiple assemblies, thereby enhancing equipment utilization and Overall Equipment Effectiveness (OEE).
“We are excited to unveil our latest innovations at SMTconnect 2024,” said Miles Moreau, General Manager at KIC. “With Contact-less Thermal Analysis™ and Common Recipe Finder™, we continue to push the boundaries of thermal process control, empowering manufacturers to achieve unprecedented levels of precision and efficiency in their production processes.”
Visit KIC at the SmartRep booth 4A.225 during SMTconnect 2024 to experience its Contact-less Thermal Analysis™ and Common Recipe Finder™.
Learn more about KIC’s Contact-less Thermal AnalysisTM and Convection Detection at www.kicthermal.com/reflowheattransfer.
For more information about KIC and its revolutionary solutions, please visit www.kicthermal.com.
