Nihon Superior to Exhibit SN100CV® P608 Halogen-free, Lead-free, No-clean Solder Paste at APEX 2025

Nihon Superior Co. Ltd., an advanced joining material supplier, is pleased to announce its participation in the 2025 IPC APEX EXPO at the Anaheim Convention Center, March 18-20, 2025. Visitors to Booth #2206 will experience Nihon Superior’s latest breakthroughs in soldering technology, including the SN100CV® P608 solder paste, the LF-C2 lead-free alloy, and the TempSave™ series of low-temperature soldering materials, designed to meet the evolving needs of the electronics manufacturing industry.

SN100CV® P608 – High Strength and Halogen-Free

Nihon Superior’s SN100CV® P608 solder paste sets a new industry standard as a completely halogen-free, lead-free, and no-clean solution. Unlike traditional silver-containing alloys that rely on a dispersion of Ag3Sn particles, SN100CV derives its strength from solute atoms within the tin matrix, ensuring exceptional mechanical properties. In tensile tests, SN100CV matches the strength of SAC305, while offering high resistance to impact loading, making it ideal for a variety of applications.

The P608 flux medium delivers wetting performance comparable to halogen-containing pastes, offering excellent results across a wide range of components and process parameters. This makes SN100CV® P608 a robust, high-performance solution for manufacturers prioritizing reliability and halogen-free production.

LF-C2 Lead-Free Alloy – Superior Strength for High-Reliability Applications

For applications requiring strength beyond that of SAC305, Nihon Superior introduces the LF-C2 lead-free alloy. Combining both dispersion and solid solution strengthening, LF-C2 provides superior mechanical strength and reliability. With a liquidus temperature of 213°C, it enables reflow at a lower temperature compared to SAC305, addressing challenges related to energy consumption and thermal stress on components.

TempSave™ Series – Advanced Low-Temperature Solutions

The TempSave™ series offers next-generation low-temperature soldering materials designed to reduce energy use, minimize package warpage, and protect temperature-sensitive devices.

• TempSave B58: A eutectic SnBi alloy with a low melting point of 139°C, providing an ideal solution for applications requiring low reflow temperatures.
• TempSave B37: A ductile hypoeutectic SnBi alloy without silver, delivering superior drop performance that surpasses SAC305. Paired with the P610 flux medium, TempSave B37 is a completely halogen-free solution capable of reflowing with a peak temperature of 190°C.
• TempSave B37 P611: A high-speed jetting paste version of TempSave B37, offering consistent dot sizes for applications requiring precision and speed.

Nihon Superior’s continued innovation supports the industry’s goals of improving reliability, reducing energy consumption, and enhancing manufacturing efficiency. By combining high-performance alloys with advanced flux technology, the company delivers solutions that address the most demanding challenges in electronics production.

Visit Nihon Superior at Booth #2206 during IPC APEX EXPO 2025 to learn how these innovative soldering solutions can optimize your manufacturing processes and improve product reliability.

For more information, visit www.nihonsuperior.co.jp/english.