Magnalytix’s Dr. Mike Bixenman to Lead Two-Part Professional Development Session at APEX 2025

Magnalytix’s Dr. Mike Bixenman to Lead Two-Part Professional Development Session at APEX 2025

Magnalytix, providing real-time reliability solutions for electronics manufacturing, is excited to announce that the company’s President Dr. Mike Bixenman will lead the professional development course “Designing for Reliability: Preventing Leakage Currents and ECM on High-Reliability Assemblies Exposed to Harsh Environmental Conditions” at IPC APEX 2025. The two-part course is scheduled to take place on Monday,…


Magnalytix, providing real-time reliability solutions for electronics manufacturing, is excited to announce that the company’s President Dr. Mike Bixenman will lead the professional development course “Designing for Reliability: Preventing Leakage Currents and ECM on High-Reliability Assemblies Exposed to Harsh Environmental Conditions” at IPC APEX 2025. The two-part course is scheduled to take place on Monday, March 17, 2025, at the Anaheim Convention Center from 9 AM-12 PM and 1:30-4:30 PM.

Dr. Bixenman will be joined by leading cleaning experts Dr. Adam Klett of KYZEN and Vladimir Sitko of PBT-Works to present the full picture of designing for reliability.

Electronic Hardware is the backbone of emerging and sustainable technologies. Printed circuit board designs are asked to do more, necessitating miniaturization, closer distances between conductors, and smaller bottom-terminated components. The bias distribution and voltages are increasing. Placement of components and thermal management is a critical design factor.

When exposed to harsh environmental conditions, materials and components can affect the device’s reliability. Flux residues and the outgassing effects under low-profile components can result in electrical drifts. The moisture characteristics of flux residues, laminates, and polymers can result in transient films that bridge conductors. Each of these conditions can result in leakage currents and electrochemical migration.

Printed circuit board cleanliness and ionic residues increase the need for cleaning. Residues from PCB manufacturing and flux residues from PCBA soldering can be problematic. Selective soldering, manual soldering, and rework can transfer residues to neighboring components. All these factors influence device reliability.

To register and attend this professional development offering and for additional conference information including the program schedule, click here.

To learn more about Magnalytix’s full slate of services, test boards, and real-time reliability solutions, visit www.magnalytix.com.

 


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