Essemtec Takes Home 2025 EM Innovation Award for Game-Changing Spider 2025 with Jet-on-the-Fly for High Speed Solder Paste Jetting and Dispensing

Essemtec is proud to announce that the Spider 2025 has been honored with the 2025 EM Innovation Award. The prestigious award was presented during the ceremony held on March 27, 2025, in conjunction with Productronica China at the Shanghai New International Expo Center.

The Spider 2025, now enhanced with Jet-on-the-Fly technology, offers a highly versatile, non-contact solution capable of handling complex PCB designs across a wide range of applications, from high speed solder paste and SMT glue, UV adhesives, flux, silver epoxy, and more. The Spider is a strong tool to overcome the limitations of traditional stencil printing and fully versatile with its dispensing heads.

The Spider 2025 allows for 2 combined processes and 5 different dispensing solutions: Solder Paste Jetting, Piezo valve, micro-screw valve, volume valve and time pressure valve, maximizing both flexibility and process efficiency. Solder paste jetting and fluid jetting with the Piezo valve are enhanced by the Jet-on-the-Fly technology, which operates on the principle of continuous motion dispensing. This eliminates the need for stopping between deposits, significantly increasing speed, precision, and efficiency in the dispensing process. Seamless integration with Essemtec’s intuitive Falcon software ensures a smooth user experience, empowering operators to quickly adapt to varying production requirements. The Gerber file import feature further streamlines the process by automatically generating solder paste jetting recipes, significantly reducing preparation time for new jobs.

The Jet-on-the-Fly technology, powered by Essemtec’s Software, sets a new benchmark for speed and precision. Capable of achieving an average of 280,000 dots per hour on boards and nearly 500,000 dots per hour for BGA patterns, the Spider 2025 leverages precision-matched solder paste rheology and advanced valve mechanics to ensure optimal dot formation. The system’s ability to dispense droplets as small as 1.8nL with high placement accuracy enables reliable processing of 01005 components and 0.4mm pitch designs, meeting the ever-shrinking requirements of today’s advanced electronics assemblies. Additionally, its precise solder paste jetting capability allows dispensing into cavities and at varying Z-levels, making it ideal for complex SMT & advanced packaging applications such as Package-on-Package (PoP), Cip on Chip (CoC) and System-in-Package (SiP) designs.”

“Receiving the 2025 EM Innovation Award for our Spider 2025 is a tremendous honor and a reflection of our commitment to pushing the boundaries of dispensing technology,” said Klaus Salmhofer, Director Asia-Pacific for Essemtec. “The Spider 2025’s Jet-on-the-Fly technology delivers the speed, precision, and flexibility our customers need to stay ahead in today’s fast-paced, high-reliability manufacturing environments.

Receiving the award, Pierre-Jean Cancalon, Head of Marketing and Communication for Essemtec, Winter Leng, GM of Intellengine, Agent of Essemtec in China, Klaus Salmhofer, Director Asia-Pacific for Essemtec, Jeff Ouyang, Managing Director for DKSH China and Damien Tao, General Manager for DKSH TEC SCE/LSS China, Distributor of Essemtec in China.

“DKSH China is proud to be the strategic partner of Essemtec, and we would like to congratulate Essemtec on winning the award. We believe that the Spider 2025 will help our customers to overcome more challenging issues,” said Damien Tao, General Manager – DKSH TEC SCE/LSS China.

“This award is a testament to Essemtec’s unwavering commitment to the Chinese market,” said Winter Leng. “We are proud to represent Essemtec’s cutting-edge solutions in China, and we believe that innovations like the Spider 2025 will continue to drive the future of high-precision dispensing technology and adaptive SMT solutions.“

First introduced at SMTA Guadalajara in September 2024, the Spider 2025 has already demonstrated up to 50% speed improvements for select materials and applications. Whether used as a complement to stencil screen printing—reducing the number of required stencil steps—or as a complete replacement for traditional solder paste printing in high-mix, high-precision environments, the Spider 2025 delivers a new level of process efficiency and flexibility to manufacturers worldwide. The Spider 2025 is catering to the needs of multiple industries such as Automotive, Aerospace, Electronic manufacturing services and Semiconductor.

Established in 2006, the EM Innovation Awards program strives to recognize and celebrate excellence in the Asian electronics industry, inspiring companies to achieve the highest standards and push the industry forward.

A huge thank you to our customers, team, and partners for making this possible!

 Learn more about the Spider 2025 here: www.essemtec.com