ElectronicsNews

Bob Bouchard to Present Vacuum Reflow Profiling Strategies
 at SMTA Michigan

BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, is pleased to announce that Bob Bouchard, Director of Sales, will present at the SMTA Michigan Expo & Tech Forum. The presentation entitled, “Vacuum Reflow Thermal Profile Challenges” will take place Tuesday, May 17, 2022 at the Laurel Manor Banquet & Conference Center in Livonia, MI. 

 Inline vacuum reflow solutions inherently increase the potential for thermal profile compromise. Expectations need to be set when considering vacuum reflow solutions, whereby, the thermal profile approach may need to be adapted. This presentation explores the thermal profile challenges and discusses strategies to towards achieving the thermal profile.

Bouchard has experience in various technical, marketing and sales roles at BTU over the last 30 years. While spending much of his career in product development and product management, he has been in the industry since the mid-1990s, involved with many thermal applications and processes including SMT reflow, curing, semiconductor packaging, solar cells and other high temperature applications such as brazing, sintering and hybrid electronics.

To learn more visit www.btu.com.