Jon Hughes
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Tracoinsa has built a conveyor testbed using ifm sensors extensively. The system is designed to compare different conveyor technologies under continuous, instrumented operation.
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ByteSnap Design has released a practical guide to MISRA compliance. The resource distils hard-won lessons from automotive projects into a pragmatic approach to safety-critical embedded software.
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Contrinex has expanded its weld-immune portfolio with miniature sensors. The new Ultra Weld Miniature Flat Pack targets space-constrained welding cells where heat, spatter, and impact routinely destroy conventional devices.
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Neurizon has secured FDA clearance for its NUZ-001 regimen. The decision allows the therapy to enter the HEALEY ALS Platform Trial in early 2026, strengthening Neurizon’s route toward a potential new treatment for ALS.
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Ainsley Signs targets growth with new swissQprint Nyala investment. The Manchester business has installed a Generation 5 Nyala flatbed printer to accelerate expansion into retail, design, and trade markets. The machine’s speed, substrate flexibility, and energy efficiency support the company’s strategy to triple turnover and broaden its production capability.
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Ransomware attackers increasingly strike when industrial cybersecurity staffing is weakest. New data from Semperis shows a majority of attacks now land during holidays, weekends, and periods of corporate upheaval — conditions that often leave industrial operators exposed as identity systems and OT networks face heightened risk.
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AI now monitors cattle welfare continuously at Nebraska plant round-the-clock. A new computer-vision platform replaces manual audits with always-on oversight.
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IWCF has introduced Quality Assured to endorse non-accredited training globally. The new assurance framework applies nine standards covering course design, delivery, assessment, digital learning, and continuous development to strengthen global oil and gas well control competence.
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AMD has introduced EPYC Embedded 2005 processors for embedded infrastructure. The compact Zen 5-based BGA parts target networking, storage, and industrial designs that demand high compute density, power efficiency, and long-term availability.
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CEA-Leti and STMicroelectronics have unveiled a sequentially integrated RF platform. Their IEDM 2025 paper combines SiGe HBTs, RF SOI switches, and high-quality passives on a single all-silicon wafer for future front-end modules.
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