Innodisk has launched a High-Speed 10GbE LAN Series for edge AI systems that need faster data exchange between sensors, edge servers, endpoints, and embedded controllers.
The new portfolio includes M.2 and low-profile PCIe modules, giving system builders compact networking options for industrial computers where board space, thermal constraints, and mechanical layout can limit conventional expansion. Applications include AI inference, automated guided vehicles, autonomous mobile robots, smart factory vision, and network video recording.
As edge AI workloads grow, 1GbE links can become a limiting factor for high-resolution video, multi-sensor inputs, and time-sensitive control data. Innodisk’s 10GbE modules use Intel E610 and X710 Ethernet controllers and support DPDK, PTP, and SR-IOV, helping accelerate packet processing, maintain time synchronisation, and improve resource allocation in virtualised environments.
The range is available in M.2 2242, M.2 2280, and low-profile PCIe formats. A daughterboard architecture, combined with high-speed shielding cables, allows the modules to be integrated into space-constrained systems without extensive board redesign.
Selected models support operation from -40°C to 85°C, extending the portfolio into harsher environments such as outdoor edge installations, factory automation, and equipment exposed to wider ambient temperature swings. That wide-temperature capability is particularly relevant where AI processing is moving closer to machines, vehicles, and field assets.
Innodisk has also extended the boundaries of M.2-based networking with the EGPL-T203, a dual-port 10GbE LAN module with wide-temperature support, and the EGPL-T2F1, an M.2-based SFP+ LAN module supporting optical and direct-attached copper SFP+ modules. Additional models, including EGPL-T103, ELPL-T101, and ELPL-T201, broaden the line-up for different deployment requirements.
Further product information is available from Innodisk’s LAN Series page.
