As part of its mission to advance knowledge and support the electronics manufacturing industry through technical training and education, ZESTRON Academy is pleased to announce its upcoming webinar, “Ensuring Reliability in Advanced Packaging: The Cleaning Challenge,” taking place on October 9th at 2:00 PM EDT. The session will be led by Kalyan Nukala, M.S.Ch.E., Senior Applications Engineer at ZESTRON Americas.
The electronics industry is experiencing rapid change as semiconductor packaging continues to evolve with highly advanced technologies such as System-in-Package (SiP), flip chip ball grid arrays (fcBGA), Package-on-Package (PoP), and 2.5D architectures. These innovations bring remarkable performance improvements but also introduce new and complex reliability challenges. Larger die sizes, increased bump counts, and standoff heights now dipping below 50 micrometers make flux residue removal more difficult, particularly under low-profile components. The addition of other factors like standoff heights below 50μm and components like QFNs and LGAs further complicate the process, increasing the rest of failures from electrochemical migration and electrical leakage.
This webinar will provide attendees with a deeper understanding of why proper cleaning is an essential step in safeguarding the long-term performance of advanced packages. The session will will discuss the latest cleaning strategies that can be implemented to reduce risks, optimize processes, and prevent failure in high-reliability applications.
The webinar is open to all professionals working with advanced semiconductor packaging who are seeking to improve reliability outcomes and better understand the role of cleaning in long-term product performance. For more information and to register for free, please visit https://www.zestron.com/usa/en/education/2025-cleaning-webinars.
