Indium Corporation Technical Support Engineer Carson Burt will deliver a technical presentation on solder paste best practices at the SMTA Empire Expo and Tech Forum, to be held October 1 in East Syracuse, New York.
The presentation, Engineering Out Defects: Solder Paste Selection and Handling Best Practices, will focus on solder paste selection, storage, and handling best practices for printed circuit board (PCB) assembly, and will connect the principles to the defect mechanisms they influence. Each best practice is an opportunity to prevent defects and promote a robust assembly process.
“Reliable PCB assembly starts long before the first print,” said Burt. “From the time the paste is manufactured to the moment it’s put on the stencil, disciplined handling protocols preserve and optimize performance.”
Burt is based at Indium Corporation’s global headquarters in Clinton, New York. He is responsible for providing technical assistance to optimize the selection and use of Indium Corporation’s materials, as well as providing product and process training. Burt earned his bachelor’s degree in chemistry from Clarkson University, and he is a Certified SMT Process Engineer (CSMTPE).
The presentation will take place on Wednesday, October 1, at 11:00 a.m.
To learn more about Indium Corporation’s innovative solder solutions, visit https://www.indium.com/.
