ZESTRON to Present at Upcoming iMAPS Device Packaging Conference

ZESTRON, the leading global provider of high-precision cleaning products, services, and training solutions in the electronics manufacturing and semiconductor industries, proudly announces Senior Application Engineer Ravi Parthasarathy will be presenting defluxing strategies for high-density advanced packaging with ultra-fine pitch die on Chip-on-Wafer (CoW) technology during his presentation at the upcoming iMAPS Device Packaging Conference (DPC) on Thursday, March 21, from 10:30 AM to 11:30 AM.

With his extensive experience and expertise in the field, Sr. Applications Engineer, Ravi Parthasarathy will delve into the challenges and solutions related to defluxing strategies for high-density advanced packaging. The presentation will focus on the unique demands of ultra-fine pitch die on CoWs, providing valuable insights and practical approaches to enhance cleaning processes.

ZESTRON is at the forefront of developing cutting-edge solutions for precision cleaning and Ravi’s presentation aligns perfectly with the company’s commitment to advancing industry knowledge and addressing emerging challenges.

ZESTRON invites all DPC attendees to join Ravi Parthasarathy’s presentation on Thursday, March 21, from 10:30 AM to 11:30 AM, and visit the ZESTRON booth to learn more about their state-of-the-art precision cleaning solutions.

About ZESTRON:

ZESTRON is headquartered in Manassas, Virginia, and operates in over 35 countries. With eight technical centers worldwide and the industry’s most knowledgeable team of engineers focused on high-precision cleaning, ZESTRON’s commitment to ensuring that its customers surpass even the most stringent cleaning requirements is without equal.

For additional information or to tour one of our technical centers, please visit www.zestron.com.