Tria Technologies has unveiled the TRIA SM2S-IQ615 and TRIA OSM-LF-IQ615 modules, marking a significant advancement in computer-on-module (COM) technology. These modules, equipped with Qualcomm’s Dragonwing IQ-615 processor, deliver industrial-grade AI-ready performance, robust peripheral support, and energy efficiency, catering to the demands of developers and engineers pushing the boundaries of edge AI.
The SM2S-IQ615 SMARC module and OSM-LF-IQ615 Open Standard Module both incorporate the Qualcomm Kryo Gen 4 CPU, featuring a 64-bit Octa-Core processor and a Qualcomm Adreno 612 GPU. These components are designed for Linux-based edge applications, offering enhanced performance and energy efficiency. The Qualcomm Hexagon V66 DSP, with Dual Hexagon Vector, supports developers in creating cost-effective, energy-efficient machine learning applications.
Markus Mahl, Senior Product Manager at Tria Technologies, stated, “We are proud to deliver the industry’s module-based access to the Dragonwing IQ-6 Series.” This collaboration with Qualcomm Technologies positions Tria customers at the forefront of edge-AI processing advancements.
Developers can embark on projects using the Dragonwing IQ6 Series, from software development and AI model tuning to real-world testing and validation. Both modules are equipped with Yocto Linux BSP as standard, with optional support for Ubuntu Linux OS.
Christian Bauer, Product Marketing Manager at Tria Technologies, noted, “Dragonwing processors are designed to provide high-performance, low-power edge computing and on-device AI.” The embedded compute boards facilitate rapid development across industries, enhancing product development cycles with scalability and flexibility.
Douglas Benitez, Senior Director of Business Development at Qualcomm Europe, Inc., remarked, “Tria Technologies’ latest portfolio expansion with the SM2S-IQ615 and OSM-LF-IQ615 modules marks a significant milestone in our joint commitment to advancing edge AI.”
The modules also offer advanced security features, including Secure boot, TrustZone, and Qualcomm Trusted Execution Environment, alongside hardware-supported KeyStore. They support fast and low-power LPDDR4 memory technology, accompanied by up to 256GB eMMC Flash memory.
An extensive array of interfaces is provided for embedded applications, including Dual Gigabit Ethernet, PCI Express Gen. 2, USB 2.0/3.1, DP v1.4, MIPI-DSI, LVDS, and up to 3x MIPI CSI-2 for camera connectivity, ideal for embedded vision, machine learning, and multimedia applications.
Both modules come with development kits and board support packages to expedite integration and prototyping. The SM2S-IQ615 module is compliant with the SMARC 2.2 standard, facilitating seamless integration with SMARC baseboards, while the OSM-LF-IQ615 module adheres to the OSM 1.2 standard.
For further information on the SM2S-IQ615, visit the Tria SM2S-IQ615 page, and for the OSM-LF-IQ615, visit the Tria OSM-LF-IQ615 page.
