Stackable multi-row board-to-board connector platform snaps together without solder

ENNOVI’s ENNOVI-MB2B multi-row board-to-board (BTB) connector platform features a proprietary ‘snap-in biscuit’ design, allowing multiple connector units to be stacked together without solder. This approach enables different pin count requirements to be accommodated via the same basic interconnect platform, without any extra expense or engineering effort.

The new multi-row BTB connectors feature ENNOVI´s 0.4mm miniPLX press-fit terminals, made from a copper alloy, exhibit very low levels of contact resistance (<1mΩ). Each pin has a 3A current carrying capability. The optional coating of these pins with the company’s IndiCoat plating technology mitigates tin whisker build-up, this preventing the risk of short circuits and extending operational lifespan. 

ENNOVI-MB2B connectors are available in board stacking heights from 7mm to 30mm. They can have between 1 and 6 rows, with up to 30 contact terminals being incorporated into each row. Conforming with automotive performance requirements, these rugged products can withstand high humidity levels (8 hour cycling up to 10% RH), mechanical shock (35g for 5 to 10ms across 10 axes) and vibration (8 hour per axis). A working temperature range of -40°C to +150°C is supported.

There are a broad variety of applications that the robust, high-density, scalable multi-row BTB connectors will be targeted at. Among the most prominent of these are going to be electric vehicles (EVs), particularly for Electric Power Steering (EPS) and Electronic Control Unit (ECU) functions.