Seika Machinery Hosts Second Webinar on Process Control: Advanced Testing and Profiling Techniques


Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, is pleased to announce the continuation of its Process Control Webinar Series with an in-depth session focusing on advanced testing techniques and profiling for soldering processes. The upcoming webinar, scheduled to take place Wednesday, September 4, 2024 at 1 p.m. EST, will delve into the intricacies of solder paste testing, reflow, wave and selective soldering systems. Led by Charlie Fujikawa, this session will provide valuable insights into enhancing manufacturing quality and reliability. 

Registration is now open! Join us for this informative session by registering here: Webinar Registration Link.

In this second session of the Process Control series, we will explore further testing of solder properties, including solder paste tackiness, which can fluctuate depending on viscosity and temperature. The Malcom TK-1 Tackiness Tester will be featured, showcasing its ability to predict solder paste tack time and prevent dropped components. With three convenient testing methods—IPC, Depth Method, or JIS Standard Test—the TK-1 offers comprehensive analysis to determine the precise point at which component adhesion may fail, thus helping to avoid costly rework.

The webinar will also introduce Malcom’s Wetting Balance Tester (SWB-2), an automated solution for measuring the wetting force of through-hole components using wave solder. This tool is essential for quickly evaluating the wettability of components, flux, and solder, in compliance with ANSI J-STD-003, MIL-STD 883, ISO 9455-16, and JIS Z 3198 standards. The SWB-2 provides quantitative data that replaces traditional “dip & look” testing, offering a more accurate and reliable method for quality assurance.

Additionally, the session will highlight Malcom’s RCX Series, a modular system for monitoring various aspects of the reflow process. The RCX Series allows for the measurement of critical parameters such as oxygen density, air velocity, rail/conveyor vibration, and even real-time onboard PCB camera observations. The flexibility of the RCX system, with its ability to add on additional sensors, makes it an indispensable tool for R&D and troubleshooting in modern manufacturing environments.

This webinar is a must-attend event for professionals looking to deepen their understanding of process control in soldering and enhance their manufacturing processes with cutting-edge technology.

For more information, contact Michelle Ogihara at 310-540-7310; e-mail michelle@seikausa.com; or visit www.seikausa.com.