Nihon Superior to Highlight TempSave Soldering Materials at IPC APEX
Nihon Superior Co. Ltd., an advanced joining material supplier, is pleased to announce that it will exhibit its newly developed TempSave series during the 2022 IPC APEX Virtual EXPO, scheduled to take place Jan. 25-27, 2022 at the San Diego Convention Center, San Diego, CA. The company also will showcase its TipSave N alloy along with SN100CV P608 and LF-C2 P608 solder pastes.
Nihon Superior’s TempSave™ series of low temperature soldering materials has been designed to address the industry’s goals of reduced peak reflow temperature to reduce defects contributing to package warpage, reduce energy consumption during the reflow process, and avoid potential damage to temperature sensitive devices. TempSave B58 is a eutectic SnBi alloy with a melting point of 139°C while TempSave B37 is a ductile hypoeutectic SnBi alloy and does not contain Ag.
High bismuth containing alloys are known to be brittle and therefore poor in drop shock performance. However, TempSave B37 has outstanding drop performance, even dramatically outperforming SAC305. The halogen-free P610 flux medium is specifically designed for Bi alloys. The TempSave B37 P610 solder paste can be reflowed with a peak temperature of 190°C. Additionally, TempSave B37 is available as a flux cored wire.
When a solder joint is made with a soldering iron, the tin reacts with the iron plating on the tip, gradually eroding it. Eventually the underlaying copper is exposed resulting in damage to the tip. TipSave N slows this erosion, extending the tip life by 3X and reducing the replacement cost of soldering tips. Paired with the (032) no-clean, halogen-free cored-flux, it provides fast wetting and low spattering. TipSave N is a good match for hand soldering as well as continuous robotic soldering as it reduces required soldering tip change overs, increasing production while reducing cost.
SN100CV® P608 is a completely halogen free, lead-free, no-clean solder paste. Unlike silver-containing alloys that derive their strength from a dispersion of fine particles of eutectic Ag3Sn, SN100CV gains its strength from solute atoms in the tin matrix of the joint. Although silver-free, in tensile tests the SN100CV alloy matches the strength of SAC305 while maintaining a high level of resistance to impact loading. LF-C2 is a high reliability lead-free alloy as it uses both dispersion and solid solution strengthening. With a liquidus temperature of 213°C it can be reflowed at a lower temperature than SAC305.
The P608 flux medium provides wetting comparable with that of halogen containing paste even though it is completely halogen-free. SN100CV P608 and LF-C2 both deliver excellent performance over a wide range of component types and process parameters.
Nihon Superior continues to offer solutions to the challenges facing the electronics industry, such as improvements in reliability, thermally stable joining, and lead-free die attach. For more information about Nihon Superior’s new alloys, solder pastes and lead-free products, please visit us at www.nihonsuperior.co.jp/english.
