New Industry Technical Paper on “Optimizing Cleaning Strategies for Advanced Packaging Technologies with Low Standoff Components”

ZESTRON, the industry’s leading provider of high-precision cleaning solutions, is proud to announce that Ravi Parthasarathy, Principal Engineer | Advanced Applications, presented his latest technical paper, “Optimizing Cleaning Strategies for Advanced Packaging Technologies with Low Standoff Components,” at the SMTA International (SMTAI) Conference 2024. The presentation was developed in collaboration with Patrick Lawrence from ITW EAE and Evan Griffith from Indium Corporationhig and highlights an innovative approach to optimizing cleaning processes for complex electronic assemblies, thereby addressing the latest challenges in electronics manufacturing.

As assemblies become more intricate, ensuring effective cleanliness without compromising throughput or cost efficiency has become essential. This paper provides manufacturers with valuable insights into achieving optimal cleaning outcomes for modern PCB designs, emphasizing the balance between cleaning efficacy, process efficiency, and cost savings.

Key Highlights of the Paper:

• New Strategies for Complex Assemblies: A breakdown of advanced cleaning approaches for multi-layered and high-density interconnect (HDI) boards to address residues in challenging areas.
• Evaluating Cleaning Agents: Insights into selecting the right cleaning agents based on contamination levels, material compatibility, and environmental considerations.
• Optimizing Equipment and Process Control: Recommendations for configuring batch and inline cleaning equipment to maximize cleaning effectiveness and minimize chemical usage.
• Best Practices in Process Validation: Key metrics and analysis methods for validating and maintaining effective cleaning performance in production.

“With evolving assembly technologies, traditional cleaning methods may fall short in removing contaminants effectively,” said Ravi Parthasarathy. “This paper provides manufacturers with actionable strategies for managing these new challenges, helping them achieve both superior cleanliness and improved productivity.”

Who Can Benefit from These Insights?
This paper offers valuable guidance to process engineers, production managers, quality assurance teams, and decision-makers in the electronics industry, especially those focused on enhancing reliability and longevity with sensitive electronic assemblies.

For more in-depth information, you can access and download the full technical paper here: https://pages.zestron.com/optimizing-cleaning-strategies?__hstc=233546881.cda08395db2e1855ebce792541ec05d9.1723483339373.1730123459122.1731074524509.16&__hssc=233546881.1.1731074524509&__hsfp=394787271