KOKI America to Exhibit at IPC APEX and Introduce New E14 Series Lead Free Solder Paste
KOKI, a global leader in soldering materials and process optimization services, will exhibit at IPC APEX 2025. Located at Booth 2410, the KOKI team will introduce its latest formulation of lead free solder paste, the E14 Series, and provide insight into its vast product offering and analytical services.
The new E14 Series paste is a lead free solder paste that reduces oxidation in vacuum reflow processes. Ideal for Power Semiconductor devices, such as MOSFETs and IGBTs, and developed to reduce material and production costs by up to 50%, the E14 series delivers next-generation performance and unmatched reliability. Engineered to eliminate flux residue after reflow, the E14 series eliminates the need for post-soldering cleaning. This innovation prevents interference with downstream processes like wire bonding and molding, streamlining your production workflow.
Key features include:
- Residue reduction, minimizing the need for cleaning
- Ensures quality of soldering and ultra-low voiding
- Available in various alloys (SAC305, Sn3.5Ag, Sn5Sb) and solder powders (IPC type3, 4, 6) for versatile applications
- Available in both printing and dispensing types
- Compliance with halogen-free standards (BS EN 14582: Br+Cl<1500ppm)
KOKI provides more than just products. Committed to providing the best support to resolve your soldering challenges, they offer various services, including product verification tasks and analysis of issues and defects in daily production. As an extension of your team, KOKI is fully committed to comprehensive support, ensuring reliability and confidence to achieve successful manufacturing outcomes.
For more information on KOKI, the new E14 Series, and other products and services, please visit https://koki-global.com/.
