Koh Young to Showcase Award-winning Inspection and Smart Factory Solutions at SMTconnect
Koh Young Technology, the industry leader in True 3D measurement-based inspection solutions, will highlight an array of award-winning inspection and measurement solutions at SMTconnnect in booth 4.A-233 on the NürnbergMesse event grounds during 10-12 May 2022. The following is just a glimpse into what Koh Young will have in store for our visitors at the tradeshow:
Solder Paste Inspection (SPI)
In 2002, we introduced the concept of 3D measurement-based solder paste inspection – and it revolutionized the inspection industry. Today, manufacturers recognize the value of the 3D measurement data and use the data to improve the print process, in turn, improving production yield and quality. Today, 3D SPI has become a standard requirement for SMT lines – it is no longer optional. The KY8030-3 is our SPI workhorse, and the most popular SPI solution in the electronics manufacturing market. With a patented dual-projection technology, we deliver trustworthy measurement data, which manufacturers can use to reliably optimize the print process.
Automated Optical Inspection (AOI)
The Koh Young 3D AOI Zenith delivers perfect inspection performance with True 3D measurement technology. In the 2D inspection world, false calls and escapes are unavoidable. To solve this problem, we took a different approach. We based our solution on full 3D measurement technology, not 2D technology and its inherent shortcomings or 2D with some 3D capabilities bolted-on to help. At Koh Young, the Zenith measures all components in True 3D. We find the component body based on true 3D profilometric information. Using this approach, we provide trustworthy inspection results, regardless of component or board colour variations. Building on the Zenith AOI, we have the Meister, which is the industry’s leading inspection systems for advanced packaging & semiconductors. When our 3D measurement
data combines with our A.I. engine, we deliver even more advantages.
Automated Pin Inspection (API)
Built on its world-class True3D AOI technology, new enhancements help it breakthrough barriers associated with inspecting products with a mix of pins and SMDs. The complete KY-P3 lineup provides an automated back-end solution combining advanced high-resolution optics and innovative AI-powered vision algorithms for single pin, press-fit, and final optical inspection, as well as for pins in a connector shroud and traditional SMDs on the same board. Because of its quantitative measurement-based approach, accuracy and repeatability is unsurpassed.
Dispense Process Inspection (DPI)
The award-winning Neptune is the industry’s first 3D optical measurement solution for transparent material inspection. Using Koh Young LIFT technology (Laser Interferometry for Fluid Tomography), the Neptune delivers non-destructive 3D inspection to precisely measure and inspect fluids – wet or dry. With its Machine-Learning algorithm, the Neptune accurately measures materials for coverage, thickness, and consistency with a user-defined threshold setting. It also identifies bubbles, cracks, and other defects in coating. It also measures underfill, epoxy, bonding, glue, potting, flux, and more to deliver an exact measurement of transparent and translucent materials.
Smart Factory Solutions
AI-powered KSMART solutions help automate process control, while focusing on data management, analysis, and optimization. It collects data from across the factory for defect detection, real-time optimization, enhanced decisions, and traceability to improve production, increase quality, and lower costs by eliminating variances, false calls, and escapes.
To learn more about how our solutions can boost your quality, visit us at SMTconnnect in booth 4.A-233 on the NürnbergMesse event grounds during 10-12 May 2022. You can plan and prepare for the event at https://smt.mesago.com/nuremberg/en/planning-preparation.html. If you are unable to attend the show, you can still learn more about our best-in-class inspection solutions at www.kohyoung.com.
