Indium Corporation to Feature Proven Products for Advanced Packaging at ECTC

April 19, 2022 WNIElectronics

Indium Corporation will feature its innovative products for advanced packaging at Electronic Components and Technology Conference (ECTC), May 31-June 3, in San Diego, Calif., U.S.

As advanced packaging techniques continue to evolve within the industry, it is necessary that materials be able to withstand the placement of complex dies into smaller and smaller packages. Indium Corporation works collaboratively with customers and other industry leaders to develop cutting-edge solutions for current and emerging advanced packaging challenges.

From water-soluble solder pastes to ultra-low residue, no-clean fluxes, Indium Corporation’s technical experts have developed an industry-proven advanced packaging portfolio designed to provide enhanced reliability in heterogeneous integration and assembly and system-in-package (SiP) applications.

As an industry leader in high-performance liquid metal-based thermal interface materials (TIM), Indium Corporation will also feature selections from its portfolio of innovative high-performance metal TIM solutions. With its portfolio of alloys that are liquid at or near room temperature, Indium Corporation’s liquid metal TIMs are designed to offer superior thermal conductivity for both TIM0 and TIM1 applications.

Solder paste solutions to be featured include:

Durafuse™ HT, a new mixed-alloy technology designed as a drop-in solution to replace and outperform the traditional high-Pb solders in die-attach and clip-bond for power discrete applications.
SiPaste^®, an ultrafine-pitch solder paste series specifically designed for fine feature printing. SiPaste^® C201HF is specifically formulated to accommodate fine feature printing, combining superior non-wet open performance with excellent stencil print transfer efficiency to satisfy the broadest range of process requirements and boost SPI yields.
LEDPaste NC38HF is a no-clean, halogen-free solder paste specifically formulated to accommodate fine feature printing, especially for mini- or micro-LED applications. It combines superior wetting performance with excellent stencil print transfer efficiency to satisfy the broadest range of process requirements for the smallest LED applications. It also delivers high tackiness and is available in a wide range of alloys, including Ag-free options.

Flux solutions to be featured include:

NC-809, a halogen-free, ultra-low residue, flip-chip flux designed to hold die or solder spheres in place without risk of die shift during the assembly process. NC-809 exhibits superior wetting performance and is the first ULR flux qualified for ball grid array ball-attach applications for packages that are sensitive to traditional water cleaning processes.
NC-702 is an award-winning no-clean, near-zero residue, halogen-free material solution designed with the tack strength to hold parts in place during placement and reflow processes. NC-702 is completely evaporated out during reflow, eliminating the time-consuming post-reflow residue cleaning steps.

Indium Corporation also offers a wide array of proven no-clean fluxes designed for today’s industry challenges, such as electronics devices in applications from the Internet of Things (IoT) to mobile devices and next-generation applications.

For more information on Indium Corporation’s innovative products, visit www.indium.com or visit Indium Corporation’s booth at the show.