Hon Hai and NXP call shotgun on smart EV technology
Hon Hai Technology Group (Foxconn) has announced a partnership with NXP Semiconductors to develop platforms for a new generation of smart connected vehicles.
A memorandum of understanding (MoU) was signed between Hon Hai, which focuses on smart technology solutions, and NXP, a global automotive semiconductor company.
The centrepiece of the new collaboration is Hon Hai’s new electric vehicle (EV) platform. It integrates NXP’s S32 family of processors, and its analog-front-end, drive, networking and power products.
The collaboration will also include next-generation platforms such as Electrical/Electronic Architecture (EEA), cybersecurity, connectivity solutions using the latest NXP S32 domain and zonal controller family for gateways and vehicle networking control.
According to Hon Hai, the partnership will also advance secure car access with Bluetooth Low Energy (BLE) and ultra-wideband (UWB).
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Safe automated driving augmented by NXP’s leading radar solutions was stated as another pillar and Hon Hai and NXP have outlined more than 10 automotive products for the first stage, which will soon be in development.
“We are proud to join forces with Hon Hai today to support its…leap into an automotive and to jointly address the challenges and opportunities of a new generation of smart, connected vehicles, especially Hon Hai’s new electric vehicle platform,” stated Kurt Sievers, president and CEO of NXP Semiconductors. “The auto industry has to become faster and more efficient, and NXP is pleased to extend its technology portfolio to enable electrification, next-generation architectures, smart car access systems and more.”
Young Liu, chairman of Hon Hai Technology Group, added: “Hon Hai sees the disruptive challenges and the potential for innovation in today’s automotive industry. This is a prime opportunity given our particular electronics expertise.”
The announcement of the partnership is hoped by both to draw on their respective industry acumen to capitalise upon the opportunities within the smart and electric automotive space. NXP touts itself as an expert in secure connectivity solutions for embedded applications with a strong market share in Microprocessors (MPU), Microcontroller (MCU), and Cybersecurity products.
Through the collaboration, the partners hope to boost Hon Hai’s ability to build EV products and boost the efficiency of its research and development (R&D) resources.
“NXP’s longstanding expertise and leadership in the automotive area, its innovative products and its laser focus on safety, security and quality provide the foundation for the collaboration we are activating today,” added chairman Liu.
A virtual MoU signing ceremony was attended by Young Liu, chairman of Hon Hai and Kurt Sievers, president and CEO of NXP from Taiwan and Germany, respectively.
