High-performance embedded computing for demanding applications
Embedded systems and display solutions provider, Review Display Systems (RDS) has announced the availability of two new COM-HPC module from leading embedded computing solutions supplier, AAEON.
The HPC-RPSC and HPC-ADSC modules offer support for 12th and 13th generation Intel Core processors and have been designed to deliver high performance embedded computing for demanding applications. The HPC-RPSC module hosts more than 10 PCIe devices, a comprehensive high-speed I/O and expandable SSD-based storage.
Supporting CPUs with up to 24 cores and 32 threads, the HPC-RPSC can manage complex parallel simulations, analyse testing data using inference modelling, and adjust clock speeds for efficient task execution using Intel Turbo Boost Technology. The module features up to 64GB of DDR5 SODIMM memory and both PEG 5.0 and PCIe 4.0 slots, making it capable of managing large datasets and integrating specialised hardware such as high-speed data acquisition or test and analysis equipment.
The HPC-RPSC offers extensive expansion options, including a PEG 5.0 slot for advanced GPU integration, three PCIe 4.0 slots, and eight PCIe 3.0 slots. Dual 2.5GbE Intel I226-LM Ethernet ports also ensure high bandwidth for data exchange. The module provides flexible SATA and NVMe storage support, while onboard TPM 2.0 enhances data security through edge encryption.
The HPC-RPSC is equipped with six USB 3.2 and two Ethernet ports for camera and sensor integration. With Intel UHD Graphics 770 and PEG slot support for graphics cards, the board enables real-time analysis of multiple video streams.
The HPC-ADSC module provides a slightly reduced function set when compared with the HPC-RPSC. The HPC-ADSC supports 12th Generation Intel Core processors only, has 10 PCIe slots, offers just 1 USB 3.2 Gen 2×2 port, reduced ethernet functionality through PCIe slots, and reduced support for advanced graphic cards. The HPC-RPSC is a more powerful and expandable board compared to the HPC-ADSC, with support for the latest 13th Generation Intel Core Processors, additional PCIe slots, faster USB ports, and advanced graphics support.
The COM HPC Client Size C module form-factor has mechanical outline dimensions of 160mm (l) x 120mm (w).
The key features of the HPC-RPSC and HPC-ADSC ensure that performance-intensive applications such as test equipment, edge AI servers, and remote monitoring systems can be easily implemented.
