High-Heat-Resistant Flexible Printed Circuit Board YFLEX – Yamaichi Electronics’ Answer to Heat Challenges

The YFLEX flexible printed circuit board from Yamaichi Electronics is now also available as a high-heat resistant version for extreme environments. This innovative FPC was developed to meet the requirements in areas such as automotive, semiconductor manufacturing and test and measurement technology.

Improved insulating layer for extreme conditions

The high-temperature resistant Flexible Printed Circuit YFLEX impresses with its improved insulating layer, which has increased adhesion thanks to the use of a special cover layer. Even under extreme temperatures of up to 150°C, it retains its electrical properties for over 3,000 hours. The continuity resistance remains within a rate of change of ±10% and the insulation resistance is 500 MΩ or higher. This outstanding resistance ensures the reliable performance of the FPC even in the most adverse environments.

Flexibility for a wide range of applications

The printed circuit board is extremely versatile and can be produced in both single-layer and double-layer configurations. The insulation substrate base can be selected from liquid crystal polymer (LCP) or polyimide (PI) in order to optimally adapt to different applications. In addition, it has a reinforced GND design that is suitable not only for high-heat-resistant but also for noise-resistant FPC applications.

Availability and ordering

Yamaichi Electronics is now accepting orders worldwide for the groundbreaking YFLEX High-Temperature FPC.