Heraeus Electronics Exhibits at PCIM Europe May 10-12th
Heraeus Electronics has announced plans to exhibit in Hall 6, Booth 322 at PCIM Europe, the leading conference and exhibition for power electronics, renewable energy and energy management. The event is scheduled to take place May 10-12, 2022 in Nuremberg. In parallel to PCIM Europe, SMTconnect will take place in halls 4, 4A and 5.
While at the show, visit Heraeus Electronics in Hall 6, Booth 322 to speak with the team about the global launch of its two new products: Condura.ultra Ag free AMB Substrate and PowerCu Soft LRB Laser Bondable Ribbon, as well as its other new solutions for interconnects and die attach. In addition to introducing its two newest products at the event, Heraeus Electronics will present during the E-mobility Forum.
The presentation entitled, “How Near is Copper Sintering?” is scheduled to take place May 10, 2022 at 11:20 a.m. CEST. Dennis Ang, Global Product Manager – Die Attach and Sinter Products, and Susanne Klaudia Duch, Project Development Leader – Copper Sinter Paste, will present comparisons, benefits and application scenarios of using Cu as an assembly material.
Silver (Ag) sintering is rated highly for its superb thermal and electrical conductivity as well as excellent reliability. It is therefore a perfect solution for the megatrend towards lifetime increase and efficiency improvement of power electronic devices in electromobility. It has taken many years for sintering with silver to be accepted for high power applications. Trends continue to indicate positive adoption of Ag sintering.
Proliferation to other segments is observed to be limited due to multi-fold cost increase, being it is silver after all. Amongst the many alternatives to replace silver, one is gaining momentum which can improve cost attractiveness and has shown excellent performance. Here, the presenters will provide more information on their investigation with regards to Copper (Cu) sintering.
The presentation entitled, “Al2O3, ZTA, AMB and What’s Next?” is scheduled to take place May 11, 2022 at 12:50 p.m. CEST. Bastian Schlüter, Global Product Manager -Metal Ceramic Substrates, will discuss how e-mobility applications and rising customer expectations put pressure on the reliability, thermal performance, lifetime and price of metal ceramic substrates. Heraeus Electronics offers with Condura® a comprehensive substrate portfolio supplemented by a variety of services beyond. DCB-Al2O3 substrates (Condura®.classic) are the long-proven standard.
For higher mechanical performance Zirconia-toughened DCB-Al2O3 (ZTA) substrates (Condura®.extra) are the material of choice. Excellent mechanical properties and a high thermal conductivity make Active Metal Brazed (AMB) Si3N4substrates (Condura®.prime) an ideal material for high-reliable e-mobility modules. This year Heraeus Electronics welcomes a new member to the Condura® family. Look forward to the next generation of substrates that combines individual advantages to one new substrate material.
To learn more about Heraeus Electronics’ two new product launches, stop by Hall 6, Booth 322 during PCIM Europe or visit www.heraeus-electronics.com
