Gen3 Launches “The Printed Circuit Assembler’s Guide to…™ Process Control” eBook in Collaboration with i-Connect007

Gen3, Global leader in SIR, CAF, Solderability, Ionic Contamination & process optimization equipment, is excited to announce the launch of the latest addition to “The Printed Circuit Assembler’s Guide to…™” eBook series in collaboration with i-Connect007.

“The Printed Circuit Assembler’s Guide to…™ Process Control,” written by Gen3 topic experts Dr. Chris Hunt and Graham Naisbitt, delves into the crucial aspects of process control and the significance of the Surface Insulation Resistance (SIR) test in maintaining and providing objective evidence. This comprehensive guide covers a range of topics, including open and closed-loop circulation, corrosion prevention, Electrochemical Migration (ECM) avoidance, process verification through SIR testing, equipment and solution choices, and more. Readers will gain valuable insights into optimizing their assembly operations and enhancing the reliability of their printed circuit assemblies.

Mike Cummings, Technical Director of TSI, and Dr. Lothar Henneken, Senior Researcher for Robert Bosch GmbH, commented, “The authors examine the role of the solvent extraction conductivity test and how it is used in maintaining process control and support for objective evidence. SEC equipment and technical details are also considered, where the equipment approach and methodology of operation are evaluated. Issues, including solution choices, solution sensitivities, and test duration are explored. The effect of CO₂ absorption is dealt with and how instruments correct for this. Solution density changes and temperature effects are discussed. The two configurations of “open” and “closed” loop circulation are reviewed. This book covers important elements of process control that relate to corrosion. It is important to avoid ECM, and here we have covered the initial objective evidence exercise of using SIR to verify a process, and then the maintenance of that process using SEC, as described in the PICT test. Finally, parameters of the SEC technique are reviewed, highlighting key sensitivities.”

“This eBook is a testament to Gen3’s commitment to knowledge sharing and industry collaboration,” said Dr. Chris Hunt, Chief Technology Officer at Gen3. “We are pleased to partner with i-Connect007 to provide valuable resources that empower professionals in the electronics assembly industry to make informed decisions and achieve process excellence.”

“The Printed Circuit Assembler’s Guide to…™ Process Control” is the second book in a two-part series, following the release of “The Printed Circuit Assembler’s Guide to…™ Process Validation.” Together, these eBooks serve as indispensable references for professionals seeking practical guidance on critical topics in the field of electronics assembly.

To access your free copy of “The Printed Circuit Assembler’s Guide to…™ Process Control” and the first book in the series, “The Printed Circuit Assembler’s Guide to…™ Process Validation,” please visit http://www.i007ebooks.com/my-i-connect007/books/process-control/. 

For more information about Gen3, visit www.gen3systems.com.