Exceeding the limits – New Meister S high resolution model 

Koh Young has announced that it has launched its new Meister S model with 3.5 µm pixel resolution and a 25 MP high speed camera.

Koh Young’s product manager Alex Lim introduced the new model in reaction to the growing demands in Wafer-Level-Packaging applications. The average bump size of 70 µm will decrease to 50 µm in near future. To fulfil future demands, Koh Young has developed a new camera and lenses system. The camera is developed and built by Koh Young and optimized for high-speed image acquisition in a 24/7 production environment.

The new model will be presented at the SMTconnect exhibition in Nuremberg.

The Koh Young team is looking forward to your visit on our booth in Hall A4/233.