CE3S Introduces the DXB-880 Wafer Bonder for High-Precision, Void-Free Bonding
Cumberland Electronics Strategic Supply Solutions (CE3S), your strategic sourcing, professional solutions and distribution partner, is proud to introduce the DXB-880 Wafer Bonder, an advanced automated system designed for void-free wafer bonding. Engineered for precision and efficiency, the DXB-880 supports key semiconductor applications, including wafer thinning, dicing, and metal plating.
With precise control over temperature, pressure, and bonding duration, the DXB-880 ensures optimal results with every cycle. The system’s dual-chamber design prevents air entrapment in the bondline, while active cooling technology significantly reduces cooling times to just 6-10 minutes, enhancing throughput.
The DXB-880 offers:
- 11-inch chamber diameter for versatile wafer bonding.
- Wide temperature range (100°-356°F/40°-180°C) for various material requirements.
- Flexible cycle times (1 minute-10 hours) to accommodate different bonding needs.
- Secure, password-protected settings with a real-time progress display for user control.
- Dual vacuum supplies (25 inHg) and a high-flow water cooling system for process stability.
Designed for ease of use and adaptability, the DXB-880 delivers reliable, high-quality bonds while optimizing production efficiency. With compact dimensions and multi-voltage compatibility (100/120 or 220/240 VAC), it seamlessly integrates into existing semiconductor manufacturing environments.
For more information about the DXB-880 Wafer Bonder, or to learn more about CE3S and its strategic sourcing, professional solutions, and distribution services, visit www.ce3s.com.
