News


  • Europlacer Announces Introductory Promotions for 2024 IPC APEX EXPO


    Europlacer, a leading provider of SMT assembly solutions, is excited to announce special introductory promotions for its latest products at the upcoming 2024 IPC APEX EXPO, scheduled to take place April 9-11, 2024 at the Anaheim Convention Center in California. Pre-APEX ii-A1 Promotion: Europlacer introduces the highly adaptable ii-A1, the most accessible SMT assembly system…


  • Need to enable anticipatory investments for Europe’s DSOs – report

    Image: Eurelectric In a new report Eurelectric calls for national regulatory authorities to allow Europe’s DSOs to make anticipatory investments to ready the power infrastructure for net zero. With calls increasing across the board for anticipatory investments in the grid, i.e. those that are not immediately needed for current projects, but which can address near-future…


  • EIB Global lends 5m to Ecuador for interconnection with Peru

    The loan agreement was signed in Ecuador’s capital city Quito by European commissioner for the Environment, Oceans and Fisheries Virginijus Sinkevičius, minister of Foreign Affairs of the Republic of Ecuador Gabriela Sommerfeld, minister of Energy and Mines of the Republic of Ecuador Andrés Arrobo, head of the Latin America and Caribbean Public Sector Division of…


  • Hitachi Energy signs transformers agreement with RWE

    Image courtesy 123rf Hitachi Energy has secured a frame agreement with transmission system operator RWE to supply transformers for their renewable energy projects in Europe. The first-ever framework agreement between the two companies consists of the supply of small power transformers (SPTs) for RWE’s growing pipeline of green energy projects in Europe. The partners established…


  • CSM Ingredients introduces latest incubator for food concepts and business models 

    CSM Ingredients – a global player in research, innovation and production of food ingredients, part of the ingredient-tech platform together with HIFOOD, Italcanditi Group and Parker Food Group – has launched Generate, its new incubator of innovative food concepts and business models that aims to bring added value to the industry. The new brand will…


  • Made Smarter and tech institutes form alliance to demystify digital adoption

    Made Smarter and leading technology demonstrators have joined forces to demystify digital transformation with a new white paper. ‘Made Smarter technologies: powering the digital transformation of SME manufacturers’ is a practical guide from the government-backed and industry-led technology adoption programme in the North West. The free-to-download document aims to inform and inspire manufacturers exploring existing…


  • Leeds Beckett University joins forces with UK firm to transform aflatoxin screening

    Leeds Beckett University is looking to increase food safety using innovative new technology. Leeds Beckett University experts have partnered with a family-owned Bradford business to revolutionise the screening process for aflatoxin in pistachio nuts, using artificial intelligence. The academic team has established a knowledge transfer partnership, partially funded by the Government through Innovate UK, to…


  • Mettler-Toledo to host a new webinar on flow wrap applications

    Mettler-Toledo Product Inspection has announced its upcoming webinar titled “4 Steps to Maximise Product Quality in Horizontal Flow Wrap Applications.” The webinar is scheduled for Wednesday 8th May with sessions at 9:00 AM and 3:00 PM GMT. In this impactful session, attendees will hear from industry experts as they explore the challenges confronting food manufacturers packaging…


  • Ventec to Launch New Bondply Dielectrics and Value-Added Services at IPC APEX 2024

    Ventec International Group is to reveal new products for advanced signal integrity and thermal performance, and introduce services, during IPC APEX Expo 2024, April 9-11 on booth # 4309. Breaking cover at the show, Ventec’s new pro-bond and thermal-bond bond ply dielectrics are formulated for high-speed signal integrity with low losses and thermal management in…


  • Renesas Introduces Industry’s First General-Purpose 32-bit RISC-V MCUs with Internally Developed CPU Core

    Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced the industry’s first general-purpose 32-bit RISC-V-based microcontrollers (MCUs) built with an internally developed CPU core. While many MCU providers have recently joined investment alliances to advance the development of RISC-V products, Renesas has already designed and tested a new RISC-V core independently,…