News


  • Ohly launches new Prodry hot sauce powders

    Ohly has launched two new culinary hot sauce powders: Prodry Chipotle Puree Powder and Prodry Aged Red Jalapeño Sauce Powder. These join the existing range of Prodry The Original ˈLouisianaˈ Hot Sauce Powder, Prodry Brined Jalapeño Powder, Prodry Cayenne Pepper Sauce Powder and Prodry Mustard Powders, to help food manufacturers deliver true taste and appeal to evolving…


  • E.ON builds digital twin for its 700,000km grid in Germany

    Image: E.ON E.ON has used smart grid software company subsidiary envelio’s technology to build a digital twin of its power grid in Germany. The digital twin, which covers more than a third of Germany’s distribution grid, is being used to evaluate data from 55 million network components such as cables or transformers and more than…


  • KHS Hamburg celebrates 50 years of pioneering achievement

    Kai Acker, CEO of KHS GmbH. The KHS production site in Hamburg, Germany, is celebrating its 50th anniversary and looking back on half a century as a PET technology pioneer as well as setting standards in the future. “Our factory in Hamburg is one of the pillars and drivers of the success andgrowth of the…


  • Ultra subminiature switches add status and fault detection for diagnostics and security

    OMRON Electronic Components Europe has extended its portfolio of sealed basic switches, adding the D2EW-R series that contains integrated resistors to detect events such as malfunctions and tampering. Depending on the voltage across the D2EW-R internal resistors, the system can differentiate between normal switch-open or switch-closed status and an open circuit or short circuit at…


  • Space and weight saving Harting Han-Modular Domino connectors available from Powell

    In stock at Powell Electronics, the supplier of connectors and more for high-rel applications including defense, aerospace and industrial, are Han-Modular Domino modules from Harting. The modular connector series enables a hybrid combination of transmission media in one module. Just as a domino has two separate fields, a domino module is made up of two…


  • HyRel Technologies and NJ MET Announce Strategic Collaboration for Integrated Component Services

    HyRel Technologies, a global provider of quick turn semiconductor modification solutions, is pleased to announce a new collaborative relationship with NJMET Inc (New Jersey Micro-Electronic Testing Inc), a longtime provider of electronic component testing and reliability analysis based in Clifton, New Jersey. The collaboration brings together two trusted names in the electronics industry, uniting over…


  • NEOTech’s Agave 1 Facility Earns AS9100 Certification for Commercial Aerospace Manufacturing Excellence

    NEOTech, a premier provider of electronic manufacturing services (EMS), integrated design engineering, and advanced supply chain solutions for the aerospace and defense, medical device, and high-tech industrial markets, proudly announces that its Agave 1 manufacturing facility in Juarez, Mexico has officially received AS9100 certification. This achievement marks a significant milestone in the company’s continued commitment…


  • Silicon Mountain Contract Services Enhances SMT Capabilities with New HELLER Reflow Oven

    Silicon Mountain Contract Services, a leading provider of custom electronics manufacturing solutions, is proud to announce a significant upgrade to its SMT production capability with the addition of a HELLER 2043 MK5 10‑zone reflow oven to its Nampa facility. The HELLER 2043 MK5 represents industry-leading technology for high-volume, high-precision reflow soldering. Key features include: 10 heated convection zones plus…


  • Libra Industries Launches In-House High Precision Underfill Capabilities

    Libra Industries, a leading provider of systems integration and electronics manufacturing services (EMS), is excited to announce the addition of high-precision underfill to its in‑house manufacturing capabilities. This new service advances Libra’s ability to support advanced packaging needs such as flip-chip, BGA, CSP, PoP, and other high-reliability assemblies. Underfill is typically a thermoset epoxy applied…


  • HPP Innovation Week highlights HPP’s critical future role

    More than a 1,000+ global attendees to HPP Innovation Week learnt how high pressure processing can shape the future of the food industry, from improving food safety and extending shelf life to meeting changing consumer demands. Showcasing the technology’s evolution from niche to mainstream, the online conference, which featured experts from five continents, confirms that…