ASC International Highlights 3D SPI and AOI at SMTA International Expo
ASC International, a leading manufacturer of 3D solder paste inspection (SPI) and automated optical inspection (AOI) systems, announces that it will exhibit at the SMTA International – Electronics Manufacturing Conference and Exposition – November 2-3, 2022 in Minneapolis. ASC International will offer live demonstrations of its industry-leading SPI and AOI solutions. The VisionPro M500, VisionPro AP500, VisionPro Merlin and the LineMaster Fusion 3D – the industry’s most cost-effective inline 3D SPI system at under $50K – will all be available for hands-on presentations.
The LineMaster Fusion 3D provide sophisticated 3D solder paste measurement coupled with an intuitive user’s interface and Windows® 10 OS. With industry-leading 4 µm X-Y pixel resolution and 0.17 µm Z height resolution sensor technology, the Fusion 3D provides exceptional value for the electronics manufacturer concerned with improving production yields hindered by poor overall quality of their print process.
The SPI system features five-minute Gerber/CAD import programming with fully integrated SPC analytics, real-time data review and qualitative analysis of solder paste deposition utilizing realistic 3D rendering for accurate print quality detection.
For more information about ASC International’s LineMaster Fusion 3D and other AOI/SPI products, visit https://www.ascinternational.com/products/solder-paste-inspection/linemaster-fusion-3d/.
