ACM Research has introduced the Ultra ECDP, a state-of-the-art tool designed for high-precision wafer-level gold bump removal and thin film etching. The system excels in delivering uniform processing outside the wafer pattern area, achieving minimal undercut for enhanced precision.
Gold’s attributes of high conductivity, corrosion resistance, and malleability make it increasingly advantageous for use in compound semiconductors, particularly in electric vehicles, 5G/6G communications, RF, and AI technologies. Dr David Wang, President and CEO of ACM Research, highlights the tool’s capacity to integrate both plating and deplating processes, utilising multi-anode technology to precisely control deplating across different areas. Additionally, the tool offers horizontal, full-face deplating to mitigate cross-contamination risks.
The Ultra ECDP supports specialised processes such as Au bump removal, thin film Au etching, and deep-hole Au deplating. It is equipped with integrated pre-wet and cleaning chambers, precise chemistry circulation, and an advanced multi-anode electrochemical deplating system. These features are engineered to minimise side etching while ensuring uniformity. According to ACM Research, the system can handle six- and eight-inch manufacturing, accommodating wafer sizes of 150 mm, 159 mm, and 200 mm, and is configurable with two open cassettes and one vacuum arm.
The introduction of the Ultra ECDP aligns with the growing demand for advanced semiconductor manufacturing solutions, particularly as the industry shifts towards more complex and diverse material requirements. This development underscores the need for precision tools capable of meeting the stringent demands of modern semiconductor applications.
