Bob Willis ‘Solder Paste Print Inspection & Defect Guide’ now available for download

The Solder Paste Print Inspection & Defect Guide, written by Bob Willis is now available for download

Printing solder paste or other conductive material requires a zero defect approach, if a high first pass yield are to be achieved using fine pitch components. Monitoring and control of paste height and volume are becoming the norm in many markets, but what capability can we expect?

Correct printer set-up, good stencil design and manufacture plus consistent materials are key to successful manufacture but inspection and monitoring the performance makes a process more robust. The same three dimensional inspection is required in AOI applications like solder joint analysis. There are common process defects during printing and with this webinar we show you the causes and cures to help yield improvement.

Download the Solder Paste Print Inspection & Defect Guide for FREE now!

Solder Paste Print Inspection & Defect Guide